Electro Ceramic Products
View our vast array of fully customizable microelectronic solutions
View our vast array of fully customizable microelectronic solutions
ECI’s thick film metalized substrates are customized to meet your device footprint requirements. Thick film metallized thru-hole and wraparound castellations provide for leadless surface mountable configurations. Applications include microwave, optoelectronic and power packages. Metallization options include Ag, Mo/Mn and W. Specialized plating processes include Au, Ni, Au/Sn, Cu, Ag and Sn.
Thick Film Metallization
Metalized ceramic components are brazed utilizing Ag, Cu/Ag and Cu/Ag/In to metal lead frames, tabs and bases. These robust products are ideal for use in high reliability applications in the military, medical, aerospace, automotive and commercial industries. Designs can be customized to meet specific customer applications.
Thick Film Metallization
ECI’s technical experience and sophisticated production techniques, enables us to offer matched and compression glass-to-metal seals for a variety of applications. Our manufacturing process include process control procedures outlined in MIL-STD-105 and ISO 9001:2015. In-process inspection and testing are performed throughout the manufacturing process in conformance with MIL-I-45208. Our ability to manufacture both standard JEDEC products and custom designs built to customer design specifications enhances our ability to assist our customers with remarkable reliability and quality.
The capabilities include legacy glass seal packages such as T0-3, 5, & 8 and Power Transistor packages including 254, 257, 258 and 259. Glass to Metal Seal packages used in Ordnance & Defense applications for detonators, primers and ignition are also available.
Glass Flatpacks, sometimes described as molded ceramic packages, are manufactured with a high temperature glass-ceramic material and can be optimized for MW/RF applications, less than 20 GHz.
The engineering team at ECI is available to help satisfy all your glass to metal seal requirements.
Glass-to-metal seals are produced via an effective production process comprised with only three involved pieces: the metal components, metal pin or lead frame, and glass preform. In order to attain the desired conditions of the final assembly, knowledge of the fundamental details is critical. Competence in glass types and formulations is a key expertise in maximizing robustness and reliability, especially when it comes to customized components. It also includes the selection of the right metal and glass combination for the intended end-use and proper execution of the sealing process to maximize the integrity of the seal. Electro Ceramic Industries in-house development capability to modify or engineer entirely new glass types allows us to fulfill unique challenges and create new applications.
The CTE of glass and metal in matched seals is balanced. Matched seals are typically used for applications where high-temperature variations are present, or tight pin pitch or dimensional requirements (for example, miniaturized or non-round shapes) are factors. Depending on the design, matched glass-to-metal seals are able to maintain integrity through tens of thousands of thermal cycles and are well suited for semiconductor and optoelectronic assemblies where structural integrity is essential for precise operation of the enclosed electronics.
Due to vastly different CTEs of glass and metal in compression seals, the outer metal eyelet shrinks firmly onto the sealing glass during the production process. This compressive force forms a seal with immense bonded physical strength. In fact, the compressive strength of glass is ten to twenty times higher than its tensile strength. This is why compression seals are typically used for designs with requirements for high mechanical robustness. Usage examples can be found in automotive and energy applications, where long-term seal integrity is essential for continued safe operation of electronics involatile environments.
Glass-to-metal seals are engineered to perform reliably in harsh operating conditions, such as extreme temperatures, moisture, pressure or chemicals. They can also fulfill requirements for long life, performance, and efficiency improvements, as well as innovative designs. The primary function of glass-to-metal seals is to enable reliable connection and protection for the manufacture of high quality and long-lasting hermetically sealed components or equipment. Flexibility is a key characteristic of glass-to-metal sealing technology. This is demonstrated by the multitude of functions, designs, and sizes of GTMS components in a broad range of applications.
ECI’s experts can utilize decades of experience to guide customers to exactly what will work and provide solutions to maximize effectiveness in their application. The ECI team has extensive experience in manufacturing power packaging, including high thermal dissipation power packages and power transistor outline packages. Typical applications include power converters, motor drives, switch mode power supplies, power hybrid circuits, and power thrusters for military, aeronautic and space applications. Utilizing either glass to metal seal (GTMS) or ceramic to metal seal (CTMS) feed thru technology, they are available as standard product form types (TO-254, TO-257, …) or custom designed to meet your needs. We can produce your power package with glass or ceramic seals, and a variety of materials. We are also always reviewing and analyzing new materials that will help solve your thermal challenges. A range of molded glass-ceramic flatpacks is in development. Typical end products include microwave and RF devices.
ECI offers a wide range of ceramic to metal sealed power packages and substrates to meet your low thermal resistance and critical thermal dissipation applications. Ceramic packaging is available in surface mount designs as well as drop in and bolt-down versions. ECI offers a wide variety of advanced thermal material flanges to provide customers with solutions for high power density applications. The offering includes RF, Power Transistors and solutions for high power densities, high current and high voltage applications.
Metal parts, stamped or machined, can be supplied as is or plated to meet customer specifications. ECI’s in-house plating capabilities provides its customers with the ability to shorten their supply chain for specialty plated metal part requirements. We provide “one stop shopping” eliminating the long lead time and added cost of sending parts out for contract plating. A wide variety of metal components including Cu, Cu/Mo, Cu/W and Mo for thermal management applications.
ECI has a complete in-house plating operation including rack and barrel plating capabilities along with robust proven proprietary processes. The ECI team is especially skilled at plating small geometry components. High quality plating services are provided for a wide variety of metal types and configurations. Quick turnaround programs are available to become an extension of your manufacturing process. A robust Non Magnetic Plating service is available for medical equipment and related applications.
Plating options include:
Gold/Tin Alloy, (80/20), plating is available for applications to eliminate the need for expensive and labor intensive preform applications. Applications can range from hermetic lids/caps, pins, plugs to surface mounted carriers.
ECI offers a line of custom cost-effective Direct Bond Copper (DBC)products on Alumina and Aluminum Nitride. Direct Bond Copper is a widely acceptable and a time proven technology for demanding thermal management applications. This is due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. ECI has the unique ability to braze metal gull wing leads and other configurations to DBC.
Electro Ceramic Industries/ ECI offers cost effective and rapid turnaround Direct Bond Copper(DBC) products on Alumina and Aluminum Nitride. Direct Bond Copper (DBC) is a widely acceptable and a long-proven technology for power electronic products due to its high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic. DBC is the direct mating of two dissimilar electronic materials (Copper and Ceramic). The interface between the pure copper and the ceramic is very reliable. The process takes advantage of the copper – oxygen eutectic where the melting point is lower than that of pure copper or oxide ceramic. At the melting temperature the eutectic is the only liquid present, it wets and bonds to both surfaces.
Utilizing various copper and ceramic thickness and ceramic type makes it is feasible to affect a resulting CTE value of total system to avoid a CTE mismatch with different semiconductor devices. The standard Direct Bond Copper or DBC technology which uses copper foil thicknesses in the range of 0.005 to 0.020inches. It is best utilized where the large geometry requirements of 0.015 inch wide lines and spacing scan be used.
Direct bond copper (DBC) substrates are comprised of a ceramic isolator, Al 2 O 3 (aluminium oxide) or AlN (aluminium nitride), onto which pure copper is bonded in a high temperature melting and diffusion process. The great heat conductivity of Al 2 O 3 (24 W/mK), AlN (180/230 W/mK) and HPS (28 W/mK), as well as the high heat capacity and heat spreading provided by the thick copper layer (200 - 600 µm),make Electro Ceramic Industries ceramic substrates irreplaceable in power electronics.
The coefficient of thermal expansion of Al 2 O 3 (7.1 ppm/K) and AlN (4.7 ppm/K) is close to that of silicon(4 ppm/K). Therefore, DBC is a suitable substrate for durable packaging of bare dice since such assemblies are not likely to fatigue during the product life.
ECI has developed a proprietary process that provides it with the unique ability to braze metal gull wing leads and other configurations to DBC. The strength of the copper bond to ceramic is subject to delamination at high temperatures and reducing atmospheres. ECI’s process does not degrade the bond and allows for more expansive designs.
ECI is your Direct Bond Copper source for all of your demanding thermal management applications. The entire ECI teams looks forward to the prospects of becoming a supplier to your organization.
ECI has over 50 years of manufacturing and mechanical package design experience coupled with a highly integrated world class manufacturing operation. The ECI engineering team is readily available to meet with you and your technical team to provide customized solutions. We understand your need to respond quickly and can provide “quick turn” programs to expedite the entire development process.Contact Us