Metalized Ceramic

Metalized Ceramic is a range of thick film metalized substrates, expertly manufactured to cater to a diverse array of design requirements. This product is specifically crafted for use in Optoelectronic, Power, and Microwave/RF packaging applications.

ECI's Metalized Ceramic is highly customizable to meet specific device footprint needs. The product features thick film metallized thru-hole and wraparound castellations, allowing for leadless surface mountable configurations. This adaptability makes it suitable for various applications including microwave, optoelectronic, and power packages.  Metallization options include Silver (Ag), Molybdenum/Manganese (Mo/Mn), and Tungsten (W). Specialized plating processes include Gold (Au), Nickel (Ni), Gold/Tin (Au/Sn), Copper (Cu), Silver (Ag), and Tin (Sn).


  • Aluminum Oxide (AL203)
  • Aluminum Nitride (AIN)
  • Beryllium Oxide (BeO)

Thick Film Metallization

  • Molybdenum Manganese
  • Tungsten


  • Single Layer
  • Wrap Arounds
  • .010" Lines and Spaces
  • Thru Hole Metallization

Get started with ECI

ECI has been serving customers around the globe for more than 50 years. We would love to work with and share our vast industry knowledge with you. Contact us to get started!

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Get started with M2 Global

M2 Global Technology, Ltd. is a premier designer and supplier of RF products and precision manufacturing services, with a strong focus on serving the defense, aerospace, and telecommunications industries. With over 30 years of experience, they provide rapid turnarounds and high-quality components for various aircraft programs and projects.

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