Metalized Ceramic is a range of thick film metalized substrates, expertly manufactured to cater to a diverse array of design requirements. This product is specifically crafted for use in Optoelectronic, Power, and Microwave/RF packaging applications.
.webp)
ECI's Metalized Ceramic is highly customizable to meet specific device footprint needs. The product features thick film metallized thru-hole and wraparound castellations, allowing for leadless surface mountable configurations. This adaptability makes it suitable for various applications including microwave, optoelectronic, and power packages. Metallization options include Silver (Ag), Molybdenum/Manganese (Mo/Mn), and Tungsten (W). Specialized plating processes include Gold (Au), Nickel (Ni), Gold/Tin (Au/Sn), Copper (Cu), Silver (Ag), and Tin (Sn).
Materials
Thick Film Metallization
Processes
